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hexfet power mosfet notes through are on page 9 features and benefits features benefits pqfn 5x6 mm applications ? secondary side synchronous rectification ? inverters for dc motors ? dc-dc brick applications ? boost converters v ds 60 v r ds(on) max (@v gs = 4.5v) 5.5 q g (typical) 44 nc r g (typical) 1.2 i d (@t mb = 25c) 100 a m low rdson (< 5.5 m . 0. 100 0. ? multi-vendor compatib ility compatible with existing surface mount techniques easier manufacturing rohs compliant containing no lead, no bromide and no halogen environmentally friendlier msl1, industrial qualification increased reliability absolute maximum ratings parameter units v ds drain-to-source voltage v gs gate-to-source voltage i d @ t a = 25c continuous drain current, v gs @ 10v i d @ t a = 70c continuous drain current, v gs @ 10v i d @ t mb = 25c continuous drain current, v gs @ 10v i d @ t mb = 100c continuous drain current, v gs @ 10v i dm pulsed drain current p d @t a = 25c power dissipation p d @ t mb = 25c power dissipation linear derating factor w/c t j operating junction and t st g storage temperature range 0.029 160 max. 20 100 400 16 c 60 16 100 v w a -55 to + 150 3.6

! " form quantity irlh5036trpbf pqfn 5mm x 6mm tape and reel 4000 irlh5036tr2pbf pqfn 5mm x 6mm tape and reel 400 eol notice # 259 orderable part number package type standard pack note

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d s g static @ t j = 25c (unless otherwise specified) parameter min. typ. max. units bv dss drain-to-source breakdown voltage 60 ??? ??? v ? v dss / t j breakdown voltage temp. coefficient ??? 0.07 ??? v/c r ds(on) static drain-to-source on-resistance ??? 3.7 4.4 ??? 4.6 5.5 v gs(th) gate threshold voltage 1.0 ??? 2.5 v . 0 0 100 100 10 0 1 . . 1 1 1 1. t d(on) turn-on delay time ??? 23 ??? t r rise time ??? 48 ??? t d(off) turn-off delay time ??? 28 ??? t f fall time ??? 15 ??? c is s input capacitance ??? 5360 ??? c os s output capacitance ??? 600 ??? c rss reverse transfer capacitance ??? 250 ??? avalanche characteristics parameter units e as single pulse avalanche energy mj i ar avalanche current a diode characteristics parameter min. typ. max. units i s continuous source current (body diode) i sm pulsed source current (body diode) v sd diode forward voltage ??? ??? 1.3 v t rr reverse recovery time ??? 28 42 ns q rr reverse recovery charge ??? 134 201 nc t on forward turn-on time time is dominated by parasitic inductance m mosfet symbol na ns a pf nc v ds = 30v ??? v gs = 16v v gs = -16v ??? ??? 400 ??? ??? 100 conditions v gs = 0v, i d = 250ua reference to 25c, i d = 1.0ma v gs = 10v, i d = 50a conditions max. 286 50 ? = 1.0mhz t j = 25c, i f = 50a, v dd = 30v di/dt = 500a/ s t j = 25c, i s = 50a, v gs = 0v showing the integral reverse p-n junction diode. ??? r g =1.7 0 0 0 1 a i d = 50a i d = 50a v gs = 0v v ds = 25v v ds = v gs , i d = 150 a v gs = 4.5v typ. v ds = 60v, v gs = 0v v ds = 16v, v gs = 0v v dd = 30v, v gs = 4.5v v gs = 10v, v ds = 30v, i d = 50a v gs = 4.5v, i d = 50a thermal resistance parameter typ. max. units r 0. 0. ??? 15 c/w r ??? 35 r 10 ??? 22

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! " fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics fig 6. typical gate charge vs.gate-to-source voltage fig 5. typical capacitance vs.drain-to-source voltage 0.1 1 10 100 v ds , drain-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) vgs top 15v 10v 4.5v 4.0v 3.3v 3.1v 2.9v bottom 2.7v 60 s pulse width tj = 25c 2.7v 0.1 1 10 100 v ds , drain-to-source voltage (v) 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) 60 s pulse width tj = 150c 2.7v vgs top 15v 10v 4.5v 4.0v 3.3v 3.1v 2.9v bottom 2.7v 1.5 2.5 3.5 4.5 5.5 v gs , gate-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) t j = 25c t j = 150c v ds = 25v 60 s pulse width -60 -40 -20 0 20 40 60 80 100 120 140 160 t j , junction temperature (c) 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( n o r m a l i z e d ) i d = 50a v gs = 10v 1 10 100 v ds , drain-to-source voltage (v) 100 1000 10000 100000 c , c a p a c i t a n c e ( p f ) v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd c oss c rss c iss 0 20406080100120 q g , total gate charge (nc) 0 2 4 6 8 10 12 14 v g s , g a t e - t o - s o u r c e v o l t a g e ( v ) v ds = 48v v ds = 30v vds= 12v i d = 50a
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fig 11. maximum effective transient thermal impedance, junction-to-case (bottom) fig 8. maximum safe operating area fig 9. maximum drain current vs. case (bottom) temperature fig 7. typical source-drain diode forward voltage fig 10. threshold voltage vs. temperature 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 v sd , source-to-drain voltage (v) 1.0 10 100 1000 i s d , r e v e r s e d r a i n c u r r e n t ( a ) t j = 25c t j = 150c v gs = 0v -75 -50 -25 0 25 50 75 100 125 150 t j , temperature ( c ) 0.5 1.0 1.5 2.0 2.5 3.0 v g s ( t h ) , g a t e t h r e s h o l d v o l t a g e ( v ) i d = 1.0a id = 1.0ma id = 150 a 25 50 75 100 125 150 t c , case temperature (c) 0 25 50 75 100 125 150 i d , d r a i n c u r r e n t ( a ) limited by package 1e-006 1e-005 0.0001 0.001 0.01 0.1 t 1 , rectangular pulse duration (sec) 0.0001 0.001 0.01 0.1 1 t h e r m a l r e s p o n s e ( z t h j c ) c / w 0.20 0.10 d = 0.50 0.02 0.01 0.05 single pulse ( thermal response ) notes: 1. duty factor d = t1/t2 2. peak tj = p dm x zthjc + tc 0.1 1 10 100 v ds , drain-to-source voltage (v) 0.1 1 10 100 1000 10000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) tc = 25c tj = 150c single pulse 10msec 1msec operation in this area limited by r ds (on) 100 sec dc limited by package

! " fig 13. maximum avalanche energy vs. drain current fig 12. on-resistance vs. gate voltage 2 4 6 8 10 12 14 16 v gs, gate -to -source voltage (v) 2 4 6 8 10 12 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( m ) i d = 50a t j = 25c t j = 125c 25 50 75 100 125 150 starting t j , junction temperature (c) 0 200 400 600 800 1000 1200 e a s , s i n g l e p u l s e a v a l a n c h e e n e r g y ( m j ) i d top 15a 18a bottom 50a fig 14. typical avalanche current vs. pulsewidth 1.0e-06 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 tav (sec) 0.1 1 10 100 1000 a v a l a n c h e c u r r e n t ( a ) allowed avalanche current vs avalanche pulsewidth, tav, assuming ? j = 25c and tstart = 125c. allowed avalanche current vs avalanche pulsewidth, tav, assuming tj = 125c and tstart =25c (single pulse)
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fig 15.

for n-channel hexfet power mosfets fig 18a. gate charge test circuit fig 18b. gate charge waveform vds vgs id vgs(th) qgs1 qgs2 qgd qgodr

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p.w. period di/dt diode recovery dv/dt ripple 5% body diode forward drop re-applied voltage reverse recovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period
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%% ? "#""&# 1k vcc dut 0 l s fig 16b. unclamped inductive waveforms fig 16a. unclamped inductive test circuit t p v (br)dss i as r g i as 0.01 t p d.u.t l v ds + - v dd driver a 15v 20v fig 17a. switching time test circuit fig 17b. switching time waveforms v gs v ds 90% 10% t d(on) t d(off) t r t f '( 1 ) $
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! " pqfn 5x6 outline "b" package details note: for the most current drawing please refer to ir website at: http://www.irf.com/package/ for more information on board mounting, including footprint and stencil recommendation, please refer to application note an-113 6: http://www.irf.com/technical-info/appnotes/an-1136.pdf for more information on package inspection techniques, please refer to application note an-1154: http://www.irf.com/technical-info/appnotes/an-1154.pdf pqfn 5x6 outline "g" package details
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pqfn 5x6 tape and reel bo w p 1 ao ko code tape dimensions reel dimensions quadrant assignments for pin 1 orientation in tape di mens i on des i gn to accommodate the component wi dth dimens ion des ign to accommodate the component lenght di mens i on des i gn to accommodate the component thi cknes s p i tch between s ucces s i ve cavi ty center s overall wi dth of the car ri er tape des cr ipt ion type package 5 x 6 pqf n note: all dimens ion are nominal di ameter reel qty wi dth reel (mm) ao (mm) bo (mm) ko (mm) p1 (mm) w quadrant pin 1 (i nch) w1 (mm) 13 4000 12.4 6.300 5.300 1.20 8.00 12 q1 note: for the most current drawing please refer to ir website at: http://www.irf.com/package/ pqfn 5x6 part marking xxxx xywwx xxxxx international rectifier logo part number (?4 or 5 digits?) marking code (per marking spec) assembly site code (per scop 200-002) date code pin 1 identifier lot code (eng mode - min last 4 digits of eati#) (prod mode - 4 digits of spn code)

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! " qualification standards can be found at international rectifier?s web site http://www.irf.com/product-info/reliability higher qualification ratings may be available should the user have such requirements. please contact your international rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ applicable version of jedec standard at the time of product release.
repetitive rating; pulse width limited by max. junction temperature. starting t j = 25c, l = 0.229mh, r g = 50 , i as = 50a. pulse width 400 s; duty cycle 2%. r is measured at t j of approximately 90c. when mounted on 1 inch square 2 oz copper pad on 1.5x1.5 in. board of fr-4 material. calculated continuous current based on maximum allowable junction temperature. package is limited to 100a by production test capability ms l 1 (per je de c j-s t d-020d ??? ) rohs compliant yes pqfn 5mm x 6mm qualification information ? moisture sensitivity level qualification level industrial ?? (per je dec jes d47f ??? guidelines ) ir world headquarters: 101 n. sepulveda blvd., el segundo, california 90245, usa to contact international rectifier, please visit http://www.irf.com/whoto-call/ date comments ? ? ? ? . ? . ? 1 . revision history 12/16/2013 4/28/2015 5/20/2015

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